TT Electronics/IRC

GS4B031151DAT

GS4B031151DAT Description

The GS4B031151DAT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it delivers a 1.15KΩ resistance per element with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this BUS-configuration network is engineered for reliability in demanding circuits. Its gull-wing termination and 1.27mm pitch facilitate automated PCB assembly, while the ceramic substrate enhances thermal performance.

GS4B031151DAT Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Robust Ceramic Package: Withstands high temperatures (125°C max) and mechanical stress.
• Tight Tolerance & Low TCR: ±0.5% tolerance and ±25ppm/°C ensure consistent performance under thermal variation.
• Optimized Power Handling: 0.4W total (0.05W per resistor) derated up to 125°C for sustained operation.
• Automation-Friendly: Gull-wing leads and SOIC-8 footprint comply with industry-standard pick-and-place processes.
• Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications where PPAP is not required.

GS4B031151DAT Applications

• Voltage Division & Pull-Up Networks: Ideal for ADC/DAC reference circuits and microcontroller I/O conditioning.
• Signal Conditioning: Used in sensor interfaces and precision amplifiers due to low TCR drift.
• Power Supply Feedback Loops: Stable resistance values enhance voltage regulation accuracy in DC-DC converters.
• Industrial Control Systems: Reliable performance in PLC modules and test equipment where temperature fluctuations occur.
• Telecom Infrastructure: Suitable for RF matching networks and filter circuits in base stations.

Conclusion of GS4B031151DAT

The GS4B031151DAT excels in precision applications requiring thermal stability, compact packaging, and high reliability. Its ceramic construction, tight tolerance, and low TCR make it superior to standard thick-film networks, particularly in environments with wide temperature swings. While not PPAP-certified for automotive use, it is a cost-effective solution for industrial, telecom, and instrumentation designs demanding repeatable performance. The tube packaging ensures protection during shipping and handling, aligning with high-volume manufacturing needs.