TT Electronics/IRC

GS4B031241JFT

GS4B031241JFT Description

The GS4B031241JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 1.24KΩ resistance value (±5% tolerance) and a ±25ppm/°C temperature coefficient, this ceramic-based network ensures reliable performance across a wide temperature range (70°C to 125°C). Its SOIC-C series construction features gull-wing terminations for secure surface mounting, while the 0.05W (1/20) power rating per resistor and 0.4W total power rating make it suitable for low-power circuits. The 100V maximum voltage rating and 5.99mm × 4.9mm compact footprint enhance its versatility in space-constrained designs.

GS4B031241JFT Features

• Bussed Network Design: 7 resistors connected in a bus configuration for simplified circuit routing.
• Thin-Film Technology: Delivers high precision (±5% absolute, ±1% ratio tolerance) and low TCR (±25ppm/°C).
• Robust Ceramic Case: Ensures durability and thermal stability in harsh environments.
• Surface-Mount SOIC Package: 8-pin narrow profile (1.45mm height) with 1.27mm pitch for high-density PCB layouts.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Non-Automotive, Non-PPAP: Ideal for industrial, telecom, and consumer electronics where PPAP compliance isn’t required.

GS4B031241JFT Applications

• Voltage Division & Pull-Up/Down Networks: Precision resistor networks in ADC/DAC circuits.
• Signal Conditioning: Stable resistance for op-amp feedback networks and filter designs.
• Industrial Controls: PLCs, sensor interfaces, and power management modules.
• Telecom Infrastructure: Line termination, impedance matching, and RF front-end circuits.
• Consumer Electronics: Audio equipment, display drivers, and embedded systems.

Conclusion of GS4B031241JFT

The GS4B031241JFT excels in applications demanding tight tolerance, low TCR, and compact form factors. Its ceramic substrate and thin-film technology provide superior stability over carbon or thick-film alternatives, while the SOIC package ensures compatibility with automated assembly processes. Though not RoHS-compliant or automotive-grade, it’s a cost-effective solution for industrial and precision analog circuits where reliability and space efficiency are critical. Engineers will appreciate its balance of performance, durability, and ease of integration.