TT Electronics/IRC

GS4B031372DAT

GS4B031372DAT Description

The GS4B031372DAT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for demanding electronic applications. Encased in a ceramic SOIC-8 package, it offers a 13.7KΩ resistance per resistor with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for precision analog and digital circuits. Its gull-wing termination and surface-mount design facilitate automated assembly, while the ceramic substrate enhances thermal performance and reliability.

GS4B031372DAT Features

• High Precision: ±0.5% tolerance and ±25ppm/°C TCR for stable performance.
• Robust Construction: Ceramic case with SOIC-8 package (4.9mm x 5.99mm x 1.45mm) ensures durability.
• Optimized Power Handling: 0.4W total (0.05W per resistor) with derating up to 125°C.
• Low-Noise Thin Film: Ideal for sensitive signal conditioning.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch for easy SMD placement.
• Non-Automotive (PPAP No): Best suited for industrial, telecom, and instrumentation use.

GS4B031372DAT Applications

This resistor network excels in:

• Voltage Divider Networks: Precision attenuation in measurement systems.
• ADC/DAC Circuits: Ensuring accuracy in data conversion.
• Industrial Control Systems: Stable performance in harsh environments.
• Medical Electronics: Reliable operation in diagnostic equipment.
• Telecom Infrastructure: Signal conditioning in base stations and routers.

Conclusion of GS4B031372DAT

The GS4B031372DAT combines precision, compactness, and thermal resilience, making it a superior choice for applications requiring tight tolerance and low drift. While not RoHS-compliant or automotive-grade, its ceramic construction and thin-film technology provide unmatched reliability in industrial and high-frequency circuits. Engineers will appreciate its balance of performance and manufacturability, particularly in space-constrained, high-reliability designs.