TT Electronics/IRC_GS4B031372DBT
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TT Electronics/IRC
GS4B031372DBT

50-GS4B031372DBT
PDF Datasheet
Res Thin Film NET 13.7K Ohm 0.5% 0.4W ±25ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B031372DBT Description

GS4B031372DBT Description

The GS4B031372DBT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it features a 13.7KΩ resistance value per resistor with an ultra-tight 0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB mounting, while the ceramic substrate enhances thermal performance.

GS4B031372DBT Features

  • Precision Thin-Film Technology: Delivers low noise and high accuracy (±0.5%) for sensitive analog/digital circuits.
  • Robust Ceramic Package: Superior heat dissipation and mechanical durability vs. plastic alternatives.
  • BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down networks.
  • Extended Temperature Range: Stable performance from -70°C to +125°C, even at derated power.
  • Compact SOIC-8 Footprint: 4.9mm × 5.99mm × 1.45mm dimensions save board space.
  • Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation (PPAP not required).

GS4B031372DBT Applications

  • Signal Conditioning: Precision dividers in ADCs/DACs and sensor interfaces.
  • Bus Termination: I²C, SPI, or memory buses requiring matched impedance.
  • Power Management: Voltage reference networks in DC-DC converters.
  • Medical/Test Equipment: High-reliability circuits where thermal drift is critical.
  • Aerospace & Defense: Ceramic construction resists vibration and thermal shock.

Conclusion of GS4B031372DBT

The GS4B031372DBT excels in precision, thermal resilience, and space efficiency, outperforming standard resistor arrays with its ceramic SOIC package and thin-film technology. While not RoHS-compliant, its 0.5% tolerance and ±25ppm/°C TCR make it a top choice for high-stability designs in harsh environments. Engineers should consider this model for critical analog systems where component-level accuracy directly impacts performance.

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