TT Electronics/IRC_GS4B031471FDT
original

TT Electronics/IRC
GS4B031471FDT

50-GS4B031471FDT
PDF Datasheet
Res Thin Film NET 1.47K Ohm 1% 0.4W ±25ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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ISO9001
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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B031471FDT Description

GS4B031471FDT Description

The GS4B031471FDT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 1.47KΩ resistance per resistor with a tight 1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this network is ideal for precision analog and digital circuits requiring reliable performance in harsh environments. Its gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration.

GS4B031471FDT Features

  • Thin-film technology: Delivers superior accuracy and stability compared to thick-film alternatives.
  • Ceramic case: Enhances thermal management and durability in high-temperature applications.
  • BUS circuit design: Optimized for bus termination, voltage division, and pull-up/down networks.
  • Compact dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
  • Non-automotive grade: Suitable for industrial, telecom, and instrumentation use where PPAP compliance isn’t required.
  • Tube packaging: Protects components during handling and assembly.

GS4B031471FDT Applications

This resistor network excels in:

  • Signal conditioning circuits in test/measurement equipment.
  • Bus termination for high-speed digital interfaces (e.g., SPI, I²C).
  • Voltage dividers in power management systems.
  • Pull-up/down networks in microcontroller-based designs.
  • Industrial control systems demanding long-term reliability under thermal stress.

Conclusion of GS4B031471FDT

The GS4B031471FDT stands out for its precision, compact form factor, and robust ceramic construction, making it a preferred choice for engineers prioritizing signal integrity and thermal resilience. While not RoHS-compliant, its thin-film accuracy and BUS-oriented design justify its use in professional-grade electronics. Ideal for space-constrained, high-reliability applications, this network balances performance with cost-effectiveness in non-automotive sectors.

FAQ

What package or case is GS4B031471FDT available in?
GS4B031471FDT is available in the SOIC package / case.
Are there related or alternative parts for GS4B031471FDT?
Is GS4B031471FDT currently in stock?
What operating temperature range does GS4B031471FDT support?
What is the mounting type of GS4B031471FDT?
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