TT Electronics/IRC

GS4B031601JGT

GS4B031601JGT Description

The GS4B031601JGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film technology. With a 1.6KΩ resistance value and ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±25ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor (0.4W total) make it suitable for circuits requiring low thermal drift. The SOIC-C series construction features gull-wing terminations for secure surface mounting, while its 100V maximum voltage rating and 125°C operating range ensure durability in industrial and automotive-adjacent applications.

GS4B031601JGT Features

• Bussed Network Design: Simplifies PCB layout with shared connections (BUS circuit designator).
• Thin-Film Technology: Delivers superior stability and precision (±2% ratio tolerance).
• Robust Ceramic Case: Enhances thermal and mechanical resilience vs. polymer-based arrays.
• Narrow SOIC (4.9mm x 5.99mm): Saves board space while supporting high-density designs.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power handling.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation uses.

GS4B031601JGT Applications

• Voltage Divider Networks: Precision dividers in sensor interfaces or ADC circuits.
• Signal Conditioning: Stable termination for communication lines (e.g., CAN bus).
• Power Supply Feedback: Current-limiting or feedback loops in DC-DC converters.
• Test & Measurement Equipment: High-accuracy resistor networks for calibration.
• Industrial Controls: Durable solution for PLCs and motor drives.

Conclusion of GS4B031601JGT

The GS4B031601JGT stands out for its ceramic construction, tight tolerances, and bussed topology, offering engineers a reliable, space-saving solution for precision analog circuits. While not PPAP-certified for automotive use, its 125°C rating and thin-film stability make it a top choice for industrial and telecom applications. Its SOIC package balances ease of assembly with performance, outperforming standard thick-film networks in thermal and long-term drift characteristics.