TT Electronics/IRC

GS4B031622JFT

GS4B031622JFT Description

The GS4B031622JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable resistance values and compact form factors. This ceramic-based thin-film resistor network offers a 16.2KΩ resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±1%, ensuring consistent performance in matched-resistance circuits. Its ±25ppm/°C temperature coefficient minimizes resistance drift across a wide operating range of -70°C to +125°C, making it suitable for demanding environments. The SOIC-C series construction provides robust mechanical stability, while the gull-wing termination ensures reliable surface-mount compatibility.

GS4B031622JFT Features

• Bussed Network Design: Simplifies PCB layout by connecting multiple resistors to a common node.
• High Power Handling: 0.4W total power rating (0.05W per resistor) with derating up to 125°C.
• Precision Thin Film Technology: Delivers low TCR (±25ppm/°C) and tight ratio tolerance (±1%).
• Compact & Durable: 4.9mm × 5.99mm × 1.45mm ceramic SOIC package with ±0.1mm dimensional tolerances.
• Automotive-Grade Alternatives: While not PPAP-certified, its 125°C max temperature suits industrial and telecom applications.
• 100V Maximum Voltage Rating: Ideal for low-to-medium voltage circuits.

GS4B031622JFT Applications

• Voltage Dividers & Pull-Up Networks: Precision-matched resistors ensure signal integrity in ADC/DAC circuits.
• Industrial Control Systems: Stable performance in harsh environments (e.g., motor drives, PLCs).
• Telecom Infrastructure: Reliable termination for high-speed data lines.
• Test & Measurement Equipment: Low TCR critical for calibration circuits.
• Power Management Modules: Bussed design simplifies bias networks in DC/DC converters.

Conclusion of GS4B031622JFT

The GS4B031622JFT excels in applications demanding miniaturization, thermal stability, and ratio-matched resistance. Its ceramic SOIC package and thin-film technology offer superior reliability over polymer-based networks, while the bussed architecture reduces component count. Though not RoHS-compliant, it remains a cost-effective solution for industrial, telecom, and precision analog designs where tight tolerances and wide temperature operation are critical. Engineers will appreciate its balance of performance, size, and durability in space-constrained, high-reliability systems.