TT Electronics/IRC

GS4B031652FDT

GS4B031652FDT Description

The GS4B031652FDT from TT Electronics/IRC is a high-precision 7-resistor thin film network in an 8-pin SOIC package, designed for surface-mount applications. With a 16.5KΩ resistance per element, 1% tolerance, and a ±25ppm/°C temperature coefficient, it ensures stable performance in demanding environments. The ceramic case and gull-wing termination enhance durability and solderability, while the 0.4W total power rating (0.05W per resistor) supports moderate power dissipation. Rated for 100V maximum voltage and 125°C operating temperature, it is suited for industrial and commercial electronics. Packaged in a tube, it facilitates automated assembly processes.

GS4B031652FDT Features

• Precision Thin Film Technology: Delivers low TCR (±25ppm/°C) and tight tolerance (1%) for stable signal conditioning.
• Robust Construction: Ceramic substrate ensures thermal stability and mechanical strength.
• Space-Efficient Design: 4.9mm × 5.99mm × 1.45mm SOIC package optimizes PCB real estate.
• High Voltage Handling: 100V rating makes it suitable for bus and divider circuits.
• Automation-Ready: Gull-wing leads and tube packaging streamline SMT assembly.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power handling.

GS4B031652FDT Applications

• Voltage Division & Bus Termination: Ideal for CAN bus, I²C, and SPI networks due to matched resistor performance.
• Signal Conditioning: Used in ADC/DAC reference circuits where precision is critical.
• Industrial Controls: Reliable in PLC modules, motor drivers, and power management systems.
• Test & Measurement Equipment: Ensures accuracy in sensor interfaces and calibration circuits.
• Consumer Electronics: Suitable for audio processing and display driver circuits.

Conclusion of GS4B031652FDT

The GS4B031652FDT resistor network excels in precision, thermal stability, and compactness, making it a superior choice for high-reliability applications. Its ceramic construction, tight tolerance, and low TCR outperform standard thick-film arrays, while the SOIC package ensures compatibility with modern SMT workflows. Whether for industrial automation, communication systems, or precision analog circuits, this component delivers consistent performance under challenging conditions. Engineers seeking a balanced blend of accuracy, power handling, and durability will find it an optimal solution.