TT Electronics/IRC

GS4B031692FFT

GS4B031692FFT Description

The GS4B031692FFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for precision applications. It features a 16.9KΩ resistance value with a tight ±1% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in critical circuits. The thin-film technology delivers a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. With a maximum operating temperature of 125°C and a derated power range of 70°C to 125°C, this network resistor excels in demanding conditions. Its 100V maximum voltage rating and 0.4W total power rating (0.05W per resistor) provide reliable operation in compact designs.

GS4B031692FFT Features

• Ceramic Case & Thin Film Technology: Ensures high stability, low noise, and excellent thermal performance.
• Precision Tolerance: ±1% absolute and ratio tolerance for accurate signal conditioning.
• Low TCR (±25ppm/°C): Minimizes resistance drift across temperature variations.
• Bussed Network (7 Resistors): Simplifies PCB layout in bus voltage divider or pull-up/down applications.
• SOIC Package (4.9mm x 5.99mm x 1.45mm): Compact footprint with gull-wing leads for easy surface mounting.
• Wide Temperature Range: Operates from -55°C to 125°C (derated above 70°C).
• Non-Automotive, Non-PPAP: Suitable for industrial and commercial electronics.

GS4B031692FFT Applications

This resistor network is ideal for:

• Voltage Division & Bus Termination: Precision networks in communication interfaces (e.g., I2C, SPI).
• Sensor Signal Conditioning: Stable performance in medical or industrial sensor arrays.
• Power Management Circuits: Reliable pull-up/down resistors in DC-DC converters or LDOs.
• Test & Measurement Equipment: Low-drift resistance for calibration circuits.
• Aerospace & Defense Electronics: Ceramic construction withstands harsh environments.

Conclusion of GS4B031692FFT

The GS4B031692FFT stands out for its ceramic thin-film construction, precision tolerances, and compact SOIC package, making it a robust choice for high-reliability applications. While not PPAP or automotive-qualified, its low TCR and bussed design offer superior performance in industrial, medical, and communication systems. Engineers will appreciate its balance of accuracy, thermal stability, and space-saving form factor in dense PCB layouts.