TT Electronics/IRC

GS4B031801FAT

GS4B031801FAT Description

The GS4B031801FAT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 1.8KΩ resistance per element with a tight 1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this BUS-designated network is ideal for precision analog and digital circuits requiring matched resistances. Its gull-wing termination and 1.27mm pitch facilitate reliable PCB mounting, while the ceramic substrate enhances thermal stability and durability.

GS4B031801FAT Features

• High Precision: 1% tolerance and ±25ppm/°C TCR for consistent performance.
• Robust Construction: Ceramic case and thin film technology ensure reliability in harsh environments.
• Space-Efficient: Compact 4.9mm × 5.99mm × 1.45mm SOIC package with 8 gull-wing terminals.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive (non-PPAP) applications.
• Low Power Dissipation: 0.05W per resistor (0.4W total) balances performance and energy efficiency.
• Easy Integration: Standard SOIC footprint simplifies PCB design and assembly.

GS4B031801FAT Applications

This resistor network excels in:

• Voltage Division & Current Sensing: Precision-matched resistors for ADC/DAC reference circuits.
• Signal Conditioning: Stable performance in op-amp feedback networks and filter designs.
• Industrial Controls: Reliable operation in PLCs, motor drives, and power management systems.
• Test & Measurement Equipment: Low TCR ensures accuracy in calibration circuits.
• Consumer Electronics: Compact size suits space-constrained designs like wearables and IoT devices.

Conclusion of GS4B031801FAT

The GS4B031801FAT combines precision, durability, and compactness, making it a superior choice for applications demanding stable resistance networks. Its ceramic construction, low TCR, and high-voltage tolerance distinguish it from generic arrays, while the SOIC package ensures compatibility with automated assembly. Though not RoHS-compliant or PPAP-approved, it remains a cost-effective solution for industrial and prototyping needs where exacting performance is critical.