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GS4B031872CT
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GS4B031872CT Description
GS4B031872CT Description
The GS4B031872CT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 8-pin Narrow SOIC device features 7 bussed (BUS) thin-film resistors with a 18.7KΩ resistance value and an exceptional ±0.25% absolute tolerance. Its ±25ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction offers a compact footprint (4.9mm x 5.99mm x 1.45mm) with gull-wing terminations for reliable surface-mount assembly. Rated for 100V maximum voltage and 0.4W total power dissipation, this network balances precision with robustness.
GS4B031872CT Features
- High Precision: ±0.25% tolerance and ±25ppm/°C TCR for critical analog/digital circuits.
- Durable Construction: Ceramic substrate with thin-film technology enhances thermal stability and longevity.
- Space-Efficient: Narrow SOIC (8-pin) package optimizes PCB real estate in dense layouts.
- Bussed Configuration: Simplifies circuit design by interconnecting resistors (BUS topology).
- Wide Temperature Range: Operates reliably from -70°C to +125°C (derated power up to 125°C).
- Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch facilitate automated assembly.
- Non-Automotive: Ideal for industrial, telecom, and instrumentation applications (PPAP not required).
GS4B031872CT Applications
- Voltage Dividers & Pull-Up Networks: Precision signal conditioning in ADCs/DACs.
- Industrial Control Systems: Stable feedback loops in PLCs and sensor interfaces.
- Medical Electronics: High-reliability circuits where thermal drift is critical.
- Telecom Infrastructure: Impedance matching and termination in high-frequency modules.
- Test & Measurement Equipment: Calibration circuits demanding tight tolerance (±0.25%).
Conclusion of GS4B031872CT
The GS4B031872CT excels in applications requiring tight tolerance, low TCR, and compact packaging. Its ceramic thin-film design ensures durability under thermal stress, while the bussed architecture reduces component count. Though not RoHS-compliant, it remains a top choice for non-automotive precision electronics. Engineers will appreciate its balance of performance, size, and cost in high-reliability systems. For designs needing 18.7KΩ networks with minimal drift, this model offers a compelling solution.



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