TT Electronics/IRC

GS4B031872GFT

GS4B031872GFT Description

The GS4B031872GFT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for surface-mount applications, it features a thin-film ceramic construction for enhanced thermal stability and reliability. With a resistance value of 18.7KΩ, ±2% absolute tolerance, and ±25ppm/°C temperature coefficient, this network ensures consistent performance in demanding environments. The SOIC-C series offers a compact footprint (4.9mm × 5.99mm × 1.45mm) with gull-wing terminations for secure PCB mounting. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, it operates across a -70°C to +125°C temperature range.

GS4B031872GFT Features

• Bussed Network Design: Simplifies circuit layout with shared connections, reducing component count.
• High Precision: ±2% tolerance and ±1% ratio tolerance ensure tight resistance matching.
• Robust Construction: Ceramic substrate and thin-film technology provide low noise and high stability.
• Wide Temperature Range: Derated power operation up to 125°C suits industrial and automotive (non-PPAP) applications.
• Compact SOIC Package: 1.27mm terminal pitch and 1.63mm seated height enable high-density PCB designs.
• Non-RoHS Compliant: Ideal for legacy systems requiring specific material properties.

GS4B031872GFT Applications

• Voltage Divider Networks: Precision attenuation in sensor interfaces and ADC circuits.
• Signal Conditioning: Stable resistance paths in instrumentation and control systems.
• Industrial Electronics: Durable performance in power supplies, motor drives, and test equipment.
• Telecom Infrastructure: Reliable termination and impedance matching in high-frequency modules.
• Legacy Equipment Upgrades: Drop-in replacement for systems requiring non-RoHS components.

Conclusion of GS4B031872GFT

The GS4B031872GFT excels in precision, thermal resilience, and space efficiency, making it a superior choice for bussed resistor networks. Its ceramic thin-film construction and tight tolerances cater to high-reliability applications, while the SOIC package ensures compatibility with automated assembly. Though not PPAP-capable or RoHS-compliant, it remains a robust solution for industrial, telecom, and legacy systems demanding stable performance under thermal stress.