TT Electronics/IRC

GS4B032051GT

GS4B032051GT Description

The GS4B032051GT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 2.05 kΩ resistance value per resistor with a tight ±2% tolerance and a low ±25 ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of -70°C to +125°C. The thin-film technology delivers superior accuracy and reliability, while the 0.05W (1/20) power rating per resistor and 0.4W total power rating make it suitable for low-power circuits. With a 100V maximum voltage rating and gull-wing termination, this network is optimized for surface-mount assembly in compact PCB designs.

GS4B032051GT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Bussed (common-node) configuration simplifies circuit design in multi-resistor applications.
• Narrow SOIC (SOIC-C) package (4.9mm × 5.99mm × 1.45mm) with ±0.1mm length/height tolerances for precise placement.
• Low TCR (±25 ppm/°C) minimizes resistance drift under temperature fluctuations.
• 2% absolute tolerance ensures consistent performance in precision analog/digital circuits.
• Thin-film construction offers superior long-term stability vs. thick-film alternatives.
• 100V voltage rating and 125°C max operating temperature for robust operation in harsh environments.

GS4B032051GT Applications

Ideal for industrial, medical, and instrumentation systems requiring high-density resistor networks, the GS4B032051GT excels in:

• Voltage divider networks and signal conditioning circuits.
• Sensor interface modules where low TCR and tight tolerance are critical.
• Automotive ECU peripherals (non-AECQ qualified; PPAP not supported).
• Embedded control systems leveraging its compact SOIC footprint.
• Precision DAC/ADC reference circuits due to minimal drift.

Conclusion of GS4B032051GT

The GS4B032051GT combines ceramic reliability, thin-film precision, and space-saving SOIC packaging to address demanding resistor network needs. Its bussed architecture, low TCR, and 2% tolerance make it a standout choice for engineers prioritizing accuracy in constrained layouts. While not automotive-qualified, it is well-suited for industrial and medical electronics where stable performance under thermal stress is paramount. For designs requiring high-density, low-drift resistor arrays, this model offers a compelling balance of performance and miniaturization.