TT Electronics/IRC

GS4B032101GT

GS4B032101GT Description

The GS4B032101GT from TT Electronics/IRC is a high-performance 7-resistor bussed network designed for precision applications in demanding environments. Housed in an 8-pin narrow SOIC ceramic package, this thin-film resistor network offers a 2.1KΩ resistance per element with a tight ±2% absolute tolerance and an ultra-stable ±25ppm/°C temperature coefficient. Rated for 0.05W (1/20W) power dissipation per resistor and 0.4W total power, it operates reliably across a wide temperature range of -70°C to +125°C, making it suitable for industrial and automotive-grade designs. The 100V maximum voltage rating and gull-wing termination ensure robust performance in surface-mount applications.

GS4B032101GT Features

• Ceramic SOIC Package: Enhances thermal stability and mechanical durability.
• Bussed Network (7 Resistors): Simplifies circuit design by interconnecting resistors.
• Precision Thin Film Technology: Delivers low TCR (±25ppm/°C) and tight tolerance (±2%).
• High-Temperature Operation: Derated power up to 125°C for harsh environments.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• 1.27mm Terminal Pitch: Compatible with standard SOIC PCB layouts.

GS4B032101GT Applications

Ideal for voltage division, pull-up/pull-down networks, and signal conditioning in:

• Industrial Control Systems: PLCs, motor drives, and sensors requiring stable resistance under thermal stress.
• Automotive Electronics: Engine control units (ECUs) and infotainment systems (note: non-automotive PPAP).
• Test & Measurement Equipment: Precision instrumentation where low drift is critical.
• Power Management Circuits: Load sharing and current limiting in compact designs.

Conclusion of GS4B032101GT

The GS4B032101GT stands out for its ceramic construction, precision thin-film resistors, and bussed topology, offering superior thermal performance and design flexibility. While not RoHS-compliant, its high-temperature resilience and low TCR make it a preferred choice for engineers prioritizing reliability in harsh conditions. Its SOIC footprint ensures easy integration into space-constrained layouts, bridging the gap between performance and miniaturization.