TT Electronics/IRC

GS4B032200GT

GS4B032200GT Description

The GS4B032200GT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 8-pin narrow SOIC package features 7 bussed resistors with a 220Ω resistance value and a tight ±2% tolerance, ensuring reliable signal integrity and minimal deviation. Its thin-film technology delivers excellent stability with a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC-C series construction provides robust mechanical durability, while the gull-wing termination ensures secure surface-mount attachment. Rated for 100V maximum voltage and 0.4W total power dissipation, this network operates across a 70°C to 125°C derated power range, with a 125°C maximum operating temperature.

GS4B032200GT Features

• Ceramic case for superior thermal and mechanical resilience.
• Bussed circuit design simplifies PCB layout and reduces component count.
• 0.05W (1/20) power rating per resistor ensures balanced load distribution.
• 1.27mm terminal pitch and 1.45mm profile enable high-density mounting.
• Non-compliant with EU RoHS, suitable for legacy or specialized applications.
• Tube packaging for automated assembly compatibility.
• ±0.1mm length/height tolerances for precise placement.

GS4B032200GT Applications

This resistor network excels in:

• Analog signal conditioning in industrial control systems.
• Voltage divider networks for sensor interfaces.
• Bus termination in communication hardware (e.g., CAN, LIN).
• Power supply feedback circuits requiring stable resistance.
• Automotive test environments (though not PPAP/automotive-qualified).

Conclusion of GS4B032200GT

The GS4B032200GT combines precision, durability, and space efficiency, making it a standout choice for engineers needing reliable resistor networks in compact designs. Its ceramic substrate and thin-film technology outperform standard epoxy-based arrays in thermal performance, while the bussed configuration reduces layout complexity. Ideal for industrial, telecom, and instrumentation applications where stability and miniaturization are critical.