TT Electronics/IRC

GS4B032201GAT

GS4B032201GAT Description

The GS4B032201GAT from TT Electronics/IRC is a high-performance 7-resistor thin film network in an 8-pin SOIC package, designed for precision applications. With a 2.2KΩ resistance per resistor and a tight 2% tolerance, this component ensures reliable signal conditioning and voltage division in compact circuits. Its ceramic case and thin film technology provide excellent thermal stability, with a low ±25ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating ensure robust operation in demanding conditions. Packaged in a tube, it is ideal for automated assembly processes.

GS4B032201GAT Features

• Precision Thin Film Technology: Delivers stable performance with minimal drift.
• Ceramic SOIC Package: Enhances thermal management and durability.
• Low TCR (±25ppm/°C): Maintains accuracy across a wide -70°C to +125°C range.
• Gull Wing Termination: Facilitates reliable surface-mount (SMD) soldering.
• High Power Density: 0.4W total dissipation in a compact 4.9mm × 5.99mm × 1.45mm footprint.
• Automation-Friendly: Tube packaging supports high-volume PCB assembly.

GS4B032201GAT Applications

This resistor network excels in:

• Analog Signal Processing: Voltage dividers, pull-up/pull-down networks in sensor interfaces.
• Industrial Controls: Precision feedback circuits in motor drives and power supplies.
• Test & Measurement Equipment: Stable reference networks for calibration devices.
• Aerospace & Defense: Reliable performance in harsh environments due to ceramic construction.

Conclusion of GS4B032201GAT

The GS4B032201GAT stands out for its precision, thermal resilience, and compact design, making it a superior choice for engineers needing reliable resistor networks in space-constrained, temperature-variable applications. Its thin film technology and ceramic case offer long-term stability, while the SOIC package ensures compatibility with modern SMD workflows. Ideal for industrial, automotive (non-PPAP), and high-reliability systems, this component balances performance with manufacturability.