


TT Electronics/IRC
GS4B032322JFT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B032322JFT Description
GS4B032322JFT Description
The GS4B032322JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 23.2KΩ resistance per element and ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±25ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for thermally sensitive circuits. The SOIC-C series construction offers robust mechanical stability, while the gull-wing termination facilitates easy surface mounting.
GS4B032322JFT Features
- Bussed Network Design: 7 resistors connected in a shared-bus configuration, simplifying PCB layout.
- Thin-Film Technology: Delivers low noise and high stability (±1% ratio tolerance).
- Wide Temperature Range: Operates from 70°C to 125°C with derated power handling.
- High Voltage Rating: Supports up to 100V, ideal for industrial and automotive (non-AEC-Q200) applications.
- Compact & Durable: Ceramic case with 4.9mm × 5.99mm footprint and 1.45mm height, ensuring space efficiency.
- Precision Tolerance: ±5% absolute and ±1% ratio tolerance for matched resistance values.
GS4B032322JFT Applications
- Analog Signal Conditioning: Precision dividers and feedback networks in op-amp circuits.
- Industrial Controls: PLCs, sensor interfaces, and power management systems.
- Test & Measurement Equipment: Calibration circuits requiring stable resistance ratios.
- Consumer Electronics: Audio amplifiers and display drivers where space and reliability are critical.
- Non-Automotive Embedded Systems: Suitable for prototypes or non-PPAP designs.
Conclusion of GS4B032322JFT
The GS4B032322JFT excels in applications demanding tight tolerance, thermal stability, and compact form factors. Its ceramic construction and thin-film technology provide superior performance over carbon-based networks, while the SOIC package ensures compatibility with automated assembly. Though not automotive-grade, it is a cost-effective solution for industrial and consumer electronics where precision and durability are paramount.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










