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GS4B032401JGT
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GS4B032401JGT Description
GS4B032401JGT Description
The GS4B032401JGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 2.4KΩ resistance value and ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±25ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for thermally sensitive circuits. The SOIC-C series construction offers robust mechanical stability, while the gull-wing termination facilitates easy surface mounting. Packaged in tubes, it is ideal for automated assembly processes.
GS4B032401JGT Features
- Bussed Network Design: Simplifies circuit layout with shared connections, reducing component count.
- Thin-Film Technology: Delivers high accuracy (±5%) and low TCR (±25ppm/°C) for stable performance.
- Ceramic Case: Enhances thermal and mechanical durability, supporting operation up to 125°C.
- Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
- Power Handling: 0.4W total (0.05W per resistor) and 100V maximum voltage rating for versatile use.
- Automation-Friendly: Gull-wing leads and tube packaging streamline high-volume PCB assembly.
GS4B032401JGT Applications
This resistor network excels in:
- Voltage Division & Pull-Up/Down Circuits: Precision resistance networks in analog/digital systems.
- Industrial Controls: Stable performance in PLCs, sensors, and motor drives under fluctuating temperatures.
- Communication Hardware: Signal conditioning in RF modules and base stations.
- Test & Measurement Equipment: Low-drift resistance for calibration and reference circuits.
- Power Management: Current limiting and feedback networks in DC/DC converters.
Conclusion of GS4B032401JGT
The GS4B032401JGT combines precision, durability, and space efficiency, making it a superior choice for engineers needing reliable resistor networks in compact designs. Its ceramic construction, thin-film accuracy, and bussed topology address challenges in industrial, automotive (non-PPAP), and telecom applications. While not RoHS-compliant, its performance in high-temperature and high-voltage scenarios justifies its use in specialized electronics.



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