TT Electronics/IRC

GS4B032552BAT

GS4B032552BAT Description

The GS4B032552BAT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding circuit applications. Built with thin-film technology on a ceramic substrate, it delivers exceptional stability with a ±25ppm/°C temperature coefficient and ±0.1% absolute tolerance. The network features a 25.5KΩ resistance value per element, rated for 0.05W (1/20) power dissipation per resistor and 0.4W total power. Its 100V maximum voltage rating and 125°C operating temperature range ensure reliability in harsh environments. The gull-wing termination and surface-mount design facilitate automated assembly, while the SOIC package (4.9mm x 5.99mm x 1.45mm) offers compact integration.

GS4B032552BAT Features

• Precision Performance: ±0.1% tolerance and ±25ppm/°C TCR for stable operation in precision analog circuits.
• Robust Construction: Ceramic case and thin-film technology enhance thermal and long-term stability.
• High-Density Design: 8-pin SOIC package with 1.27mm pitch optimizes PCB space.
• Wide Operating Range: Supports -70°C to +125°C derated power and 125°C maximum temperature.
• Automation-Friendly: Gull-wing terminals and tube packaging streamline high-volume placement.
• Bussed Topology: Simplifies bus line and pull-up/pull-down configurations.

GS4B032552BAT Applications

Ideal for precision voltage dividers, sensor interfaces, and signal conditioning in:

• Industrial Controls: PLCs, instrumentation, and process monitoring.
• Medical Devices: High-accuracy measurement systems.
• Telecom Infrastructure: Signal processing and line termination.
• Test & Measurement Equipment: Calibration circuits and reference networks.
• Aerospace & Defense: Systems requiring tight tolerance and thermal resilience.

Conclusion of GS4B032552BAT

The GS4B032552BAT combines precision, compactness, and ruggedness, making it a superior choice for applications demanding tight resistance matching and thermal stability. Its ceramic substrate, thin-film technology, and bussed architecture outperform conventional networks in accuracy and reliability. While not PPAP or automotive-qualified, it excels in industrial, medical, and high-reliability sectors where low drift and high density are critical. Engineers will appreciate its balance of performance and manufacturability.