TT Electronics/IRC

GS4B032552GBT

GS4B032552GBT Description

The GS4B032552GBT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 7-resistor network features a 25.5K Ohm resistance value with a tight 2% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range of 70°C to 125°C. Housed in a ceramic SOIC-8 package with gull-wing terminations, it offers excellent thermal stability and reliability for surface-mount (SMD) applications. The device operates at a maximum voltage rating of 100V and delivers a total power rating of 0.4W (0.05W per resistor), making it suitable for compact, power-sensitive designs.

GS4B032552GBT Features

• Precision Thin-Film Technology: Delivers high accuracy (±2%) and low TCR (±25ppm/°C) for stable performance.
• Robust Ceramic Construction: Enhances thermal management and durability in harsh environments.
• Compact SOIC-8 Package: Space-saving 4.9mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch for high-density PCB layouts.
• Automated Manufacturing Compatibility: Gull-wing terminations ensure reliable solder joints in automated assembly processes.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power handling up to 125°C.
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications where PPAP compliance is not required.

GS4B032552GBT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers, feedback networks in op-amp circuits.
• Medical & Test Equipment: High-accuracy measurement systems requiring low drift.
• Telecom Infrastructure: Line termination, impedance matching in high-frequency PCBs.
• Industrial Control Systems: Robust performance in motor drives, power supplies, and sensors.
• Consumer Electronics: Space-constrained designs needing reliable passive networks.

Conclusion of GS4B032552GBT

The GS4B032552GBT combines precision, compactness, and reliability, making it a standout choice for engineers prioritizing stable resistance values under thermal stress. Its ceramic SOIC package and thin-film technology offer superior performance over thicker-film alternatives, particularly in high-temperature or precision-analog applications. While not PPAP-compliant, it remains a cost-effective solution for non-automotive sectors demanding tight tolerances and long-term durability.