


TT Electronics/IRC
GS4B032552JFT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B032552JFT Description
GS4B032552JFT Description
The GS4B032552JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications. Featuring a 25.5KΩ resistance per element with a ±5% absolute tolerance and ±1% ratio tolerance, this thin-film ceramic network ensures stable performance across a -70°C to +125°C temperature range. Its ±25ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for demanding environments. The SOIC-C series construction offers robust surface-mount compatibility, with a compact 4.9mm × 5.99mm × 1.45mm footprint and gull-wing termination for reliable PCB integration.
GS4B032552JFT Features
- Bussed Network Design: Simplifies circuit layout with shared connections for streamlined designs.
- High Stability: Thin-film technology and ceramic case ensure low noise and long-term reliability.
- Precision Tolerance: ±5% absolute and ±1% ratio tolerance for matched resistance values.
- Wide Operating Range: Derated power up to 125°C, ideal for industrial and automotive (non-PPAP) applications.
- Compact & Robust: SOIC package with 1.27mm terminal pitch for high-density PCB layouts.
- Non-RoHS Compliant: Suitable for legacy or specialized systems requiring non-compliant materials.
GS4B032552JFT Applications
- Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
- Industrial Controls: Stable resistance networks for PLCs and instrumentation.
- Power Management: Current-limiting or pull-up networks in power supplies.
- Test & Measurement Equipment: High-accuracy circuits requiring matched resistors.
- Legacy Electronics: Systems exempt from RoHS compliance.
Conclusion of GS4B032552JFT
The GS4B032552JFT excels in applications demanding tight tolerance, thermal stability, and compact form factors. Its bussed architecture reduces component count, while ceramic thin-film construction ensures durability. Though not automotive-grade or RoHS-compliant, it remains a top choice for industrial, test, and legacy systems where precision and reliability are critical. Engineers will appreciate its balance of performance and integration ease in space-constrained designs.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










