TT Electronics/IRC

GS4B032611JBT

GS4B032611JBT Description

The GS4B032611JBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications in demanding electronic circuits. Encased in a ceramic SOIC-8 package, it offers a 2.61KΩ resistance per element with a 5% tolerance and a ±25ppm/°C temperature coefficient, ensuring stable performance across a wide operating range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor), this BUS-designated network supports 100V maximum voltage, making it suitable for analog and digital signal conditioning. Its gull-wing termination and 1.27mm pitch facilitate reliable PCB assembly, while the ceramic substrate enhances thermal and mechanical durability.

GS4B032611JBT Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive circuits.
• Robust Ceramic Construction: Superior heat dissipation and resistance to mechanical stress.
• Compact SOIC-8 Package: Space-saving 4.9mm × 5.99mm footprint with 1.45mm profile for high-density designs.
• Wide Temperature Range: Operates reliably from -70°C to +125°C, even at derated power.
• Automotive-Grade Alternatives: While this model is not PPAP/Automotive certified, its performance aligns with industrial requirements.
• Non-RoHS Compliant: Suitable for legacy or exempted applications requiring leaded components.

GS4B032611JBT Applications

• Voltage Division & Bus Termination: Ideal for CAN bus, I2C, and SPI networks in industrial controls.
• Signal Conditioning: Precision attenuation in sensor interfaces, ADCs, and DACs.
• Power Management: Load balancing in DC-DC converters and power supplies.
• Test & Measurement Equipment: Stable reference resistors for calibration circuits.
• Aerospace & Defense: Harsh-environment applications due to ceramic ruggedness.

Conclusion of GS4B032611JBT

The GS4B032611JBT excels in precision, thermal resilience, and compact integration, distinguishing it from generic resistor arrays. Its ceramic SOIC package and thin film technology cater to engineers needing repeatable performance in high-temperature or vibration-prone environments. While not RoHS-compliant, it remains a robust choice for industrial, telecom, and legacy systems where reliability outweighs regulatory constraints. For designs requiring tight-tolerance networks with low TCR, this model offers a compelling balance of performance and durability.