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GS4B032801DT
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GS4B032801DT Description
GS4B032801DT Description
The GS4B032801DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring stable performance under elevated temperatures. Housed in an 8-pin narrow SOIC package, this bussed 7-resistor array offers a 2.8KΩ resistance per element with an ultra-tight ±0.5% absolute tolerance and a low ±25ppm/°C temperature coefficient. Its thin-film technology ensures excellent long-term stability and minimal noise, while the ceramic case provides superior thermal dissipation. Rated for 0.05W (1/20) per resistor and 0.4W total power, it operates reliably across a -70°C to +125°C derated range, with a maximum voltage rating of 100V.
GS4B032801DT Features
- Precision Performance: ±0.5% tolerance and ±25ppm/°C TCR for critical analog/digital circuits.
- Robust Construction: Ceramic SOIC package ensures durability and heat resistance.
- Space-Efficient: Compact 4.9mm × 5.99mm × 1.45mm footprint with 1.27mm gull-wing pitch for high-density PCB layouts.
- Bussed Design: Simplifies circuit routing in voltage-divider or pull-up/down networks.
- Wide Operating Range: Derated power up to 125°C, suitable for industrial environments.
- Non-Automotive: Ideal for non-PPAP applications like test equipment or telecom.
GS4B032801DT Applications
This resistor network excels in:
- Precision voltage dividers in instrumentation and sensor interfaces.
- Pull-up/down networks for digital logic (e.g., microcontrollers, FPGAs).
- Signal conditioning in medical devices or aerospace systems.
- Industrial controls requiring stable resistance under thermal stress.
- Non-automotive embedded systems where ceramic reliability is prioritized.
Conclusion of GS4B032801DT
The GS4B032801DT stands out for its combination of precision, thermal resilience, and compact design, making it a superior choice over plastic-encased alternatives. While not RoHS-compliant, its ceramic construction and thin-film technology cater to niche applications demanding uncompromising performance. Engineers will value its ease of integration and consistent behavior across temperature fluctuations, particularly in prototyping or low-volume high-reliability systems.



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