TT Electronics/IRC

GS4B033002GAT

GS4B033002GAT Description

The GS4B033002GAT from TT Electronics/IRC is a high-performance 7-resistor thin film network designed for precision applications. Encased in a ceramic SOIC-8 package, it offers a 30K Ohm resistance per resistor with a tight 2% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of 70°C to 125°C. With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this surface-mount (SMD) network is ideal for demanding circuits requiring reliability and accuracy. Its gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while the ceramic case enhances thermal and mechanical durability.

GS4B033002GAT Features

• Precision Thin Film Technology: Delivers stable performance with low TCR (±25ppm/°C) and 2% tolerance.
• Robust Ceramic Package: Ensures high thermal conductivity and resistance to mechanical stress.
• Optimized Power Handling: 0.4W total dissipation (0.05W per resistor) at derated temperatures up to 125°C.
• Compact SOIC-8 Form Factor: 4.9mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances for space-constrained designs.
• BUS Circuit Designator: Simplifies integration into bus line applications.
• Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation use.

GS4B033002GAT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Industrial Control Systems: Stable resistance in PLCs, sensors, and measurement equipment.
• Telecommunications: Impedance matching and filtering in high-frequency RF modules.
• Test & Measurement Equipment: Calibration circuits requiring low drift over temperature.
• Power Management: Current-limiting networks in low-power DC/DC converters.

Conclusion of GS4B033002GAT

The GS4B033002GAT combines thin film precision, ceramic ruggedness, and compact SMD design to meet stringent performance requirements. Its low TCR, high power density, and BUS-oriented layout make it a superior choice over generic thick-film networks in applications demanding long-term stability and miniaturization. While not RoHS-compliant, its reliability in harsh environments positions it as a go-to solution for industrial and telecom designs.