TT Electronics/IRC_GS4B033010JT
original

TT Electronics/IRC
GS4B033010JT

50-GS4B033010JT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,8-Pin Narrow SOIC, Bussed elements,±25ppm/°C, 301Ohm, absolute tolerance ±5%
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B033010JT Description

GS4B033010JT Description

The GS4B033010JT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Encased in a ceramic substrate, it offers superior thermal stability with a ±25ppm/°C temperature coefficient and a 5% tolerance on its 301Ω resistance value. Rated for 0.4W total power dissipation (0.05W per resistor), it operates across a wide temperature range of -70°C to +125°C, making it suitable for harsh environments. The gull-wing termination ensures reliable surface-mount assembly, while its 100V maximum voltage rating and non-compliant EU RoHS status cater to industrial and legacy designs.

GS4B033010JT Features

  • Ceramic Construction: Enhances thermal conductivity and durability.
  • Bussed Network (BUS): Simplifies circuit design with shared connections.
  • Thin-Film Technology: Delivers low noise and high precision (±5% tolerance).
  • High-Temp Operation: Reliable performance up to 125°C with derating up to 70°C.
  • Compact SOIC Package: 4.9mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height/length).
  • Automotive-Grade Alternatives: While not PPAP/automotive-certified, its robustness suits industrial analogs.

GS4B033010JT Applications

Ideal for:

  • Voltage Divider Networks: Precision dividers in test equipment.
  • Signal Conditioning: Analog/digital interfaces where stability is critical.
  • Legacy Industrial Systems: Non-RoHS compliant designs requiring high-voltage tolerance.
  • Power Management: Auxiliary circuits in power supplies (derated power handling).
  • Harsh Environments: Ceramic casing resists thermal stress in aerospace or defense subsystems.

Conclusion of GS4B033010JT

The GS4B033010JT excels in precision, thermal resilience, and space efficiency, distinguishing itself from polymer-based networks. Its ceramic SOIC package and bussed architecture reduce PCB complexity, while the thin-film technology ensures long-term reliability. Though not automotive-qualified, it’s a cost-effective solution for industrial, instrumentation, and high-temperature applications demanding stable performance under stress. Engineers should verify compatibility for RoHS-restricted designs.

FAQ

What is the standard lead time for GS4B033010JT?
The standard lead time for GS4B033010JT is 30 weeks.
What package or case is GS4B033010JT available in?
What voltage specification is listed for GS4B033010JT?
What operating temperature range does GS4B033010JT support?
Is GS4B033010JT currently in stock?
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