TT Electronics/IRC

GS4B033011FCT

GS4B033011FCT Description

The GS4B033011FCT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor array features a 3.01KΩ resistance value per resistor with a tight 1% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in a ceramic SOIC-8 package, it offers 0.4W total power dissipation (0.05W per resistor) and supports 100V maximum voltage rating. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GS4B033011FCT Features

• Precision Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±25ppm/°C) for stable operation in varying environments.
• Robust Ceramic Construction: Enhances thermal stability and durability compared to polymer-based networks.
• Compact SOIC-8 Package: Measures 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• BUS Circuit Designator: Optimized for bus line termination, voltage division, and pull-up/down applications.
• Wide Operating Range: Rated for -55°C to +125°C, derated up to 125°C at reduced power.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation uses where automotive compliance isn’t required.

GS4B033011FCT Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Bus Termination: Impedance matching for high-speed data lines (e.g., SPI, I²C).
• Industrial Controls: Stable feedback networks in power supplies or sensor interfaces.
• Test & Measurement Equipment: Low-drift reference circuits due to its thin-film stability.
• Telecom Infrastructure: Reliable performance in RF and baseband PCBs.

Conclusion of GS4B033011FCT

The GS4B033011FCT combines precision, compactness, and ruggedness, making it a superior choice for applications demanding tight tolerance and thermal reliability. Its ceramic SOIC package and thin-film technology outperform generic thick-film arrays in critical environments. While not RoHS-compliant, it remains a cost-effective solution for industrial and telecom designs where long-term stability is paramount.