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GS4B033160CT
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GS4B033160CT Description
GS4B033160CT Description
The GS4B033160CT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. This ceramic-based thin-film resistor network offers a 316Ω resistance per element with an exceptional ±0.25% absolute tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of 70°C to 125°C. Its SOIC-C series construction provides robust performance in compact designs, with a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating. The gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB mounting, while the ceramic case enhances thermal and mechanical durability.
GS4B033160CT Features
- Precision Performance: ±0.25% tolerance and ±25ppm/°C TCR for critical analog/digital circuits.
- Robust Construction: Ceramic substrate and thin-film technology ensure long-term reliability.
- Space-Efficient: Compact 4.9mm × 5.99mm × 1.45mm footprint ideal for high-density PCBs.
- Bussed Design: Simplified circuit routing with shared common terminals (BUS configuration).
- Wide Temperature Range: Stable operation from 70°C to 125°C with derated power.
- Surface-Mount Ready: Gull-wing leads and 1.27mm pitch for automated assembly compatibility.
GS4B033160CT Applications
This resistor network excels in precision applications such as:
- Voltage dividers and current-limiting circuits in industrial control systems.
- Signal conditioning for sensors and transducers in automotive (non-Automotive PPAP) or medical devices.
- Impedance matching in communication hardware (e.g., RF modules, filters).
- Reference networks in test/measurement equipment requiring low drift.
- Power management circuits where tight tolerance and thermal stability are critical.
Conclusion of GS4B033160CT
The GS4B033160CT stands out for its combination of precision, compactness, and durability, making it a superior choice for engineers designing high-reliability electronics. Its ceramic thin-film construction and bussed architecture reduce design complexity while maintaining performance under thermal stress. While not RoHS-compliant, it remains a go-to solution for non-consumer applications demanding exacting specifications. Ideal for prototyping and production, this network balances cost-effectiveness with technical excellence.



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