TT Electronics/IRC

GS4B033160DBT

GS4B033160DBT Description

The GS4B033160DBT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor BUS-configuration array offers a 316Ω resistance per element with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of 70°C to 125°C. Housed in a ceramic SOIC-8 package with gull-wing SMD terminations, it combines 0.4W total power dissipation (0.05W per resistor) with a 100V maximum voltage rating, making it suitable for precision analog and digital circuits. The RoHS-non-compliant device is supplied in tube packaging, ideal for automated assembly.

GS4B033160DBT Features

• Precision Performance: Thin-film technology delivers ±0.5% tolerance and ±25ppm/°C TCR for critical signal conditioning.
• Robust Construction: Ceramic substrate ensures thermal stability, while the SOIC-8 package (4.9mm × 5.99mm × 1.45mm) offers mechanical durability.
• Optimized Power Handling: 0.4W total power rating (derated up to 125°C) with 0.05W per resistor, balancing compactness and reliability.
• Automation-Friendly: Gull-wing terminations (1.27mm pitch) and surface-mount design streamline PCB assembly.
• Broad Compatibility: BUS circuit designator simplifies integration into bus-line termination, voltage division, and pull-up/down networks.

GS4B033160DBT Applications

• Industrial Electronics: Precision voltage dividers and sensor interfaces in harsh environments (e.g., motor control, instrumentation).
• Communications: Impedance matching and termination for high-speed data lines (LVDS, CAN bus).
• Medical Devices: Signal conditioning circuits where stability and low drift are critical.
• Automotive (Non-Automotive Rated): Prototyping or non-safety-critical systems requiring tight-tolerance arrays.

Conclusion of GS4B033160DBT

The GS4B033160DBT excels in applications demanding high precision, thermal resilience, and compact form factors. Its ceramic SOIC package, thin-film technology, and BUS configuration provide a competitive edge over generic thick-film networks, particularly in industrial and communication systems. While not PPAP or automotive-qualified, it remains a cost-effective solution for prototyping and mid-volume production where tolerance and TCR performance are prioritized.