TT Electronics/IRC_GS4B033160DDT
original

TT Electronics/IRC
GS4B033160DDT

50-GS4B033160DDT
PDF Datasheet
Res Thin Film NET 316 Ohm 0.5% 0.4W ±25ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B033160DDT Description

GS4B033160DDT Description

The GS4B033160DDT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it features a 316Ω resistance per element with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this BUS-designated network is engineered for reliability in demanding circuits. Its gull-wing termination and 1.27mm pitch facilitate automated assembly, while the ceramic substrate enhances thermal performance.

GS4B033160DDT Features

  • Precision Thin Film Technology: Delivers low noise and high stability, critical for analog signal conditioning.
  • Robust Ceramic Package: Superior heat dissipation and mechanical strength compared to polymer-based arrays.
  • Tight Tolerance & Low TCR: ±0.5% tolerance and ±25ppm/°C ensure minimal drift in precision dividers or feedback networks.
  • Automation-Friendly Design: Gull-wing leads and SOIC footprint comply with industry-standard pick-and-place processes.
  • Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation where PPAP compliance is not required.

GS4B033160DDT Applications

  • Voltage Division: Ideal for DAC/ADC reference networks due to matched resistor ratios.
  • Impedance Matching: Used in RF/communication systems for signal integrity.
  • Sensor Interfaces: Stable performance in bridge circuits for strain gauges or pressure sensors.
  • Medical Electronics: Low-noise characteristics suit patient monitoring equipment.
  • Test & Measurement: High accuracy supports calibration tools and precision instrumentation.

Conclusion of GS4B033160DDT

The GS4B033160DDT excels in precision analog applications requiring tight tolerance, low TCR, and robust thermal performance. Its ceramic SOIC package and thin film technology offer distinct advantages over epoxy-based networks, particularly in high-temperature or high-reliability environments. While not PPAP-certified, it is a cost-effective solution for industrial, medical, and telecom systems demanding consistent performance. Engineers will appreciate its balance of accuracy, power handling, and manufacturability in space-constrained designs.

FAQ

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The standard lead time for GS4B033160DDT is 30 weeks.
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