


TT Electronics/IRC
GS4B033400GT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B033400GT Description
GS4B033400GT Description
The GS4B033400GT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 340Ω resistance value with a tight ±2% absolute tolerance and an ultra-stable ±25ppm/°C temperature coefficient. The thin-film technology ensures low noise and high reliability, while the ceramic case style enhances thermal stability. Rated for 0.05W (1/20W) per resistor and 0.4W total power dissipation, it operates across a wide temperature range of -70°C to +125°C, with a maximum voltage rating of 100V. Its gull-wing termination and 1.27mm terminal pitch facilitate easy surface-mount assembly.
GS4B033400GT Features
- Precision Network: 7 bussed resistors with 340Ω ±2% tolerance and ±25ppm/°C TCR.
- Robust Construction: Ceramic SOIC package ensures durability and thermal performance.
- High Power Handling: 0.4W total power rating (0.05W per resistor) at 125°C derated.
- Surface-Mount Ready: Gull-wing leads and 1.27mm pitch for automated PCB assembly.
- Wide Operating Range: -70°C to +125°C with stable performance.
- Low Noise: Thin-film technology minimizes parasitic effects.
GS4B033400GT Applications
Ideal for precision analog circuits, voltage dividers, and bus termination in:
- Industrial Control Systems: Stable performance in harsh environments.
- Telecommunications: Signal conditioning and impedance matching.
- Medical Electronics: Reliable operation in critical diagnostics.
- Automotive (Non-Automotive Rated): Auxiliary circuits requiring thermal resilience.
- Test & Measurement Equipment: Low-drift resistance networks for calibration.
Conclusion of GS4B033400GT
The GS4B033400GT excels in precision, thermal stability, and power handling, making it a superior choice for high-reliability applications. Its ceramic SOIC package and thin-film technology provide advantages over plastic-encased networks, particularly in thermal management and long-term stability. While not PPAP or automotive-qualified, it is well-suited for industrial, telecom, and medical designs demanding tight tolerances and low drift. Packaged in tubes for ESD protection, it ensures safe handling and integration into advanced electronic systems.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










