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GS4B033402JBT
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GS4B033402JBT Description
GS4B033402JBT Description
The GS4B033402JBT from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 7-resistor array features a 34K Ohm resistance with a 5% tolerance and a ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Encased in a ceramic SOIC package, it offers 0.4W total power dissipation (0.05W per resistor) and a maximum voltage rating of 100V. Its 8-pin gull-wing termination and surface-mount design make it ideal for automated assembly processes. The compact dimensions (4.9mm x 5.99mm x 1.45mm) and tight tolerances (±0.1mm height, ±0.2mm depth) ensure reliable integration into dense PCB layouts.
GS4B033402JBT Features
- High Precision: Thin-film technology delivers low TCR (±25ppm/°C) and 5% tolerance for consistent performance.
- Robust Construction: Ceramic substrate enhances thermal stability and durability in harsh environments.
- Space-Efficient: SOIC-8 package with 1.27mm terminal pitch optimizes board space without compromising power handling.
- Wide Operating Range: Suitable for -55°C to +125°C (derated power up to 125°C), ideal for industrial and automotive-grade designs.
- Automation-Friendly: Gull-wing leads and tube packaging streamline pick-and-place assembly.
GS4B033402JBT Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
- Industrial Control Systems: Stable resistance in PLCs, sensors, and motor drivers.
- Telecommunications: Impedance matching and filtering in RF modules.
- Test & Measurement Equipment: Calibration circuits requiring low drift over temperature.
- Power Management: Current sensing and load balancing in DC-DC converters.
Conclusion of GS4B033402JBT
The GS4B033402JBT combines precision, reliability, and compactness, making it a superior choice for applications demanding tight tolerances and thermal stability. Its ceramic construction and thin-film technology outperform carbon or thick-film alternatives in high-temperature environments. While not PPAP or RoHS compliant, its cost-effective performance suits prototyping and industrial use. Engineers will appreciate its ease of integration and consistent electrical characteristics, reducing design iterations and BOM complexity.



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