TT Electronics/IRC

GS4B033480GFT

GS4B033480GFT Description

The GS4B033480GFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable resistance values and tight tolerances. Built with thin-film technology on a ceramic substrate, it offers excellent thermal stability and low noise, making it ideal for signal conditioning, voltage division, and impedance matching. With a resistance value of 348Ω, ±2% absolute tolerance, and ±25ppm/°C temperature coefficient, this network ensures reliable performance across a wide temperature range (70°C to 125°C). Its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating suit demanding industrial and instrumentation applications.

GS4B033480GFT Features

• Ceramic SOIC-C Series: Robust construction for high thermal and mechanical stability.
• Bussed Network (BUS): Simplified PCB layout with shared common terminals.
• Precision Thin Film: Delivers ±1% ratio tolerance for matched resistance pairs.
• Wide Operating Range: -55°C to +125°C (derated power up to 125°C).
• Low TCR (±25ppm/°C): Minimizes resistance drift under temperature fluctuations.
• Gull Wing Termination: Ensures reliable surface-mount soldering.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).

GS4B033480GFT Applications

• Analog Signal Processing: Voltage dividers, gain networks in op-amp circuits.
• Industrial Controls: PLCs, sensor interfaces, and precision measurement systems.
• Automotive Electronics (non-AECQ): Non-safety-critical modules like infotainment.
• Test & Measurement Equipment: Calibration circuits, reference networks.
• Power Management: Current limiting, pull-up/down networks in DC-DC converters.

Conclusion of GS4B033480GFT

The GS4B033480GFT stands out for its ceramic-based thin-film technology, offering superior stability and precision compared to polymer-based networks. Its bussed design reduces PCB complexity, while the SOIC package ensures compatibility with automated assembly. Though not PPAP or automotive-qualified, it excels in industrial and instrumentation roles where low TCR, tight tolerances, and high power density are critical. Engineers will appreciate its balance of performance, durability, and cost-effectiveness for precision analog designs.