TT Electronics/IRC

GS4B033481GT

GS4B033481GT Description

The GS4B033481GT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for surface-mount applications, it features a 3.48KΩ resistance per element with a tight ±2% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). The ceramic-based thin-film technology provides excellent thermal stability and reliability, while the gull-wing termination ensures secure PCB mounting. With a maximum voltage rating of 100V and a power rating of 0.4W (0.05W per resistor), this network is ideal for precision analog and digital circuits.

GS4B033481GT Features

• Bussed Network Design: 7 resistors connected in a bus configuration for simplified circuit routing.
• High Precision: ±2% absolute tolerance and ±25ppm/°C TCR for consistent performance.
• Robust Construction: Ceramic substrate and thin-film technology for durability and thermal stability.
• Compact SOIC Package: 4.9mm × 5.99mm footprint with 1.63mm seated height, suitable for space-constrained designs.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Automotive-Grade Alternatives Available: Though this variant is not PPAP or automotive-qualified, similar models meet stricter standards.

GS4B033481GT Applications

• Voltage Division & Signal Conditioning: Precision resistor networks for ADC/DAC reference circuits.
• Industrial Control Systems: Stable performance in harsh environments due to ceramic construction.
• Medical Electronics: Low TCR ensures accuracy in sensitive measurement equipment.
• Consumer Electronics: Compact size suits high-density PCBs in audio/video devices.
• Power Management: Used in feedback networks for voltage regulators and current sensing.

Conclusion of GS4B033481GT

The GS4B033481GT excels in precision, reliability, and space efficiency, making it a top choice for engineers needing stable resistor networks in industrial, medical, and consumer applications. Its ceramic thin-film construction and low TCR provide superior performance over standard thick-film alternatives, while the SOIC package ensures compatibility with automated assembly processes. For designs demanding tight tolerances and thermal resilience, this network delivers exceptional value.