


TT Electronics/IRC
GS4B033571FFT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B033571FFT Description
GS4B033571FFT Description
The GS4B033571FFT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for surface-mount applications, it features a 3.57KΩ resistance value with a tight ±1% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in critical circuits. The thin-film technology delivers a low ±25ppm/°C temperature coefficient, ideal for stable operation across a wide temperature range (70°C to 125°C). With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network balances power handling and precision. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB integration.
GS4B033571FFT Features
- Ceramic Case: Enhances thermal stability and durability in harsh environments.
- Bussed Design (BUS): Simplifies circuit layout for shared voltage/ground applications.
- High Precision: ±1% tolerance and ±25ppm/°C TCR ensure minimal drift.
- Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
- Robust Power Handling: 0.4W total dissipation (derated up to 125°C).
- Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation.
- Non-RoHS Compliant: For legacy or specialized applications requiring ceramic materials.
GS4B033571FFT Applications
- Voltage Divider Networks: Precision signal conditioning in test equipment.
- Bus Termination: Stabilizes data lines in communication hardware.
- Industrial Controls: Reliable performance in PLCs and sensor interfaces.
- Power Management: Distributed load sharing in power supplies.
- Legacy Systems: RoHS-exempt designs requiring ceramic reliability.
Conclusion of GS4B033571FFT
The GS4B033571FFT excels in precision and thermal resilience, making it a standout choice for bussed resistor networks in demanding environments. Its ceramic construction, low TCR, and compact SOIC footprint address challenges in space-constrained, high-temperature designs. While not suited for automotive use, it is ideal for industrial, telecom, and legacy systems where stability and accuracy are paramount. Engineers will appreciate its balance of performance, size, and power handling in critical analog circuits.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










