TT Electronics/IRC

GS4B033601FFT

GS4B033601FFT Description

The GS4B033601FFT from TT Electronics/IRC is a high-precision 7-resistor bussed network housed in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for surface-mount applications, it features a 3.6KΩ resistance value with a tight ±1% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in critical circuits. The thin-film technology delivers a low ±25ppm/°C temperature coefficient, ideal for environments with temperature fluctuations (70°C to 125°C). With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances power handling and compactness (4.9mm × 5.99mm × 1.45mm). The gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB integration.

GS4B033601FFT Features

• Ceramic Case: Enhances thermal stability and durability in harsh conditions.
• Bussed Design (BUS): Simplifies circuit layout by connecting resistors in a common configuration.
• Precision Thin Film: Offers superior accuracy (±1%) and low TCR (±25ppm/°C) vs. thick-film alternatives.
• High-Temp Operation: Rated for 125°C, suitable for automotive and industrial applications (though non-automotive PPAP).
• Compact SOIC Package: Space-saving 8-pin narrow SOIC with ±0.1mm length/height tolerances for high-density PCBs.
• Non-RoHS: May be preferred for legacy or specialized systems requiring non-compliant materials.

GS4B033601FFT Applications

• Voltage Divider Networks: Precision dividers in sensor interfaces or ADC circuits.
• Signal Conditioning: Stable resistance paths in op-amp feedback loops or filter networks.
• Industrial Controls: Robust performance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Reliable reference resistors due to low TCR and tight tolerances.
• Aerospace & Defense: Ceramic construction suits high-reliability systems (note: verify compliance for critical use).

Conclusion of GS4B033601FFT

The GS4B033601FFT excels in precision, thermal resilience, and space efficiency, making it a standout choice for high-accuracy analog circuits and compact designs. Its ceramic SOIC package and bussed architecture reduce layout complexity, while thin-film technology ensures long-term stability. While not RoHS-compliant or automotive-grade, it remains a robust solution for industrial, instrumentation, and legacy systems demanding tight tolerances and reliability. Engineers should evaluate its non-compliance and unconfirmed status for regulated applications.