TT Electronics/IRC

GS4B033651DCT

GS4B033651DCT Description

The GS4B033651DCT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor array features a 3.65KΩ resistance per element with a tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Housed in an 8-pin SOIC ceramic package, it offers 0.4W total power dissipation (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for precision analog and digital circuits. The gull-wing termination and surface-mount design facilitate automated assembly, while the ceramic substrate enhances thermal stability and durability.

GS4B033651DCT Features

• Precision Thin Film Technology: Delivers high accuracy (±0.5%) and low TCR (±25ppm/°C) for stable performance.
• Robust Ceramic Package: Ensures excellent thermal management and mechanical strength.
• Compact SOIC-8 Form Factor: 4.9mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm length/height, ±0.2mm depth) for space-constrained designs.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Automation-Friendly: Gull-wing leads and tube packaging streamline high-volume PCB assembly.
• Wide Operating Range: Rated for 125°C maximum temperature and derated power up to 125°C.

GS4B033651DCT Applications

Ideal for:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning.
• Digital Systems: Bus termination, pull-up/down resistors, and line impedance matching.
• Industrial & Automotive Electronics: Despite lacking PPAP/Automotive certification, its ceramic construction suits harsh environments.
• Test & Measurement Equipment: Where low drift and high accuracy are critical.

Conclusion of GS4B033651DCT

The GS4B033651DCT excels in applications requiring high precision, thermal stability, and compactness. Its ceramic SOIC package, thin-film technology, and tight tolerances make it a superior choice over polymer-based networks or less stable thick-film alternatives. While not RoHS-compliant, its performance in industrial, telecom, and instrumentation systems justifies its use where reliability is paramount. Engineers should consider this model for designs demanding low TCR, high power dissipation per element, and robust construction.