TT Electronics/IRC_GS4B033740DBT
original

TT Electronics/IRC
GS4B033740DBT

50-GS4B033740DBT
PDF Datasheet
Res Thin Film NET 374 Ohm 0.5% 0.4W ±25ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B033740DBT Description

GS4B033740DBT Description

The GS4B033740DBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications in demanding electronic circuits. Encased in a ceramic SOIC-8 package, it offers a 374Ω resistance per element with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this BUS-designated network is engineered for reliability in precision analog and digital systems. Its gull-wing termination and 1.27mm pitch facilitate robust PCB assembly, while the ceramic substrate enhances thermal performance.

GS4B033740DBT Features

  • High Precision: ±0.5% tolerance and ±25ppm/°C TCR for stable performance in temperature-variable environments.
  • Robust Construction: Ceramic case and thin film technology ensure durability and low noise.
  • Optimized Power Handling: 0.4W total power rating (0.05W per resistor) with derating up to 125°C.
  • Space-Efficient: Compact 4.9mm × 5.99mm × 1.45mm SOIC package ideal for dense PCB layouts.
  • Automated Assembly-Friendly: Gull-wing leads and standardized SOIC footprint streamline SMT processes.
  • Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and instrumentation applications.

GS4B033740DBT Applications

  • Voltage Dividers & Pull-Up Networks: Precision resistance matching in ADC/DAC circuits.
  • Signal Conditioning: Stable termination for high-speed data lines (e.g., LVDS, USB).
  • Medical & Test Equipment: Low-drift performance in sensitive measurement systems.
  • Industrial Controls: Reliable operation in PLCs and motor drive feedback circuits.
  • Aerospace & Defense: Ceramic packaging meets rugged environmental requirements.

Conclusion of GS4B033740DBT

The GS4B033740DBT excels in applications demanding tight tolerance, thermal stability, and compact form factors. Its ceramic SOIC package and thin film technology provide superior performance over polymer-based networks, particularly in high-temperature or precision-critical environments. While not PPAP-qualified, it is a cost-effective solution for industrial, telecom, and instrumentation designs where reliability and accuracy are paramount. For engineers seeking a low-TCR, high-density resistor network, this model offers an optimal balance of performance and manufacturability.

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