


TT Electronics/IRC
GS4B033740JT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B033740JT Description
GS4B033740JT Description
The GS4B033740JT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 374Ω resistance value with a ±5% absolute tolerance and an ultra-stable ±25ppm/°C temperature coefficient. The thin-film technology ensures low noise and high reliability, while the ceramic case provides excellent thermal stability. Rated for 0.05W (1/20W) per resistor and 0.4W total power dissipation, it operates across a wide temperature range of -70°C to +125°C, making it suitable for harsh environments. The gull-wing termination and 1.27mm terminal pitch facilitate easy surface-mount assembly (SMT).
GS4B033740JT Features
- Bussed Network Design: 7 resistors with a common bus connection for simplified circuit routing.
- High Precision: ±5% tolerance and ±25ppm/°C TCR ensure stable performance under thermal stress.
- Robust Construction: Ceramic SOIC package (4.9mm x 5.99mm x 1.45mm) with ±0.1mm dimensional tolerances.
- Wide Operating Range: Derated power up to 125°C, with a 100V maximum voltage rating.
- Thin-Film Technology: Delivers low parasitic effects and superior long-term stability.
- Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its reliability suits industrial applications.
GS4B033740JT Applications
Ideal for precision analog circuits, voltage dividers, and signal conditioning in:
- Industrial Control Systems: Stable performance in PLCs and sensor interfaces.
- Test & Measurement Equipment: Low-noise resistor networks for accurate signal processing.
- Power Management Modules: Bussed networks for feedback or bias circuits.
- Medical Electronics: Reliable operation in diagnostic devices where consistency is critical.
- Aerospace & Defense: Ceramic packaging withstands thermal cycling in avionics.
Conclusion of GS4B033740JT
The GS4B033740JT excels in high-reliability applications requiring tight tolerance and thermal stability. Its ceramic SOIC package, thin-film construction, and bussed topology offer distinct advantages over polymer-based networks or discrete resistors. While not RoHS-compliant, it remains a robust choice for industrial and precision electronics where performance outweighs regulatory constraints. Engineers should consider this model for designs demanding low TCR, compact footprint, and repeatable performance across temperature extremes.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










