TT Electronics/IRC

GS4B033901GT

GS4B033901GT Description

The GS4B033901GT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for precision applications requiring stable resistance values under varying thermal conditions. With a 3.9KΩ resistance per element and a tight ±2% absolute tolerance, this thin-film resistor network ensures reliable signal integrity in compact circuit designs. Its ±25ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with moderate thermal stress. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating provide robust performance in low-power analog and digital circuits.

GS4B033901GT Features

• Ceramic Case & Thin Film Technology: Ensures high durability and stable performance in harsh conditions.
• Bussed Network (BUS): Simplifies PCB layout by connecting resistors in a shared configuration.
• Precision Tolerance: ±2% resistance accuracy and ±25ppm/°C TCR for consistent operation.
• Compact SOIC Package: 4.9mm × 5.99mm footprint with 1.27mm pitch, ideal for space-constrained designs.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, suitable for industrial applications.
• Gull Wing Termination: Facilitates reliable surface-mount assembly (SMT) and automated PCB placement.

GS4B033901GT Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision resistance matching in ADC/DAC interfaces.
• Industrial Control Systems: Stable performance in PLCs, sensor interfaces, and power management modules.
• Automotive Electronics (Non-Automotive Qualified): Auxiliary systems where high-temperature stability is critical.
• Medical Devices: Low-noise signal conditioning in diagnostic equipment.
• Consumer Electronics: Dense PCBs requiring compact, high-reliability passive networks.

Conclusion of GS4B033901GT

The GS4B033901GT stands out for its ceramic construction, precision tolerances, and compact SOIC footprint, making it a superior choice for engineers prioritizing thermal stability and space efficiency. While not PPAP or automotive-qualified, its thin-film technology and bussed design reduce component count and simplify routing in analog/digital hybrid systems. Ideal for industrial, medical, and consumer applications demanding repeatable performance under thermal stress.