TT Electronics/IRC

GS4B034020JCT

GS4B034020JCT Description

The GS4B034020JCT from TT Electronics/IRC is a high-performance 7-resistor thin film network designed for precision applications. Encased in a ceramic SOIC-8 package, it offers a 402Ω resistance per element with a 5% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -55°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this surface-mount network features gull-wing terminations for reliable PCB connections. Its compact dimensions (4.9mm × 5.99mm × 1.45mm) and ±0.1mm height tolerance make it ideal for space-constrained designs.

GS4B034020JCT Features

• Thin Film Technology: Delivers superior accuracy and stability compared to thick-film alternatives.
• Ceramic Case: Enhances thermal performance and durability in harsh environments.
• BUS Circuit Design: Simplifies PCB layout for bus termination or pull-up/down applications.
• Low TCR (±25ppm/°C): Minimizes resistance drift under temperature fluctuations.
• Automotive-Grade Alternatives: While not PPAP-certified, its 125°C max operating temperature suits industrial and telecom applications.
• Tube Packaging: Protects components during handling and assembly.

GS4B034020JCT Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers or impedance matching in data acquisition systems.
• Bus Termination: DDR memory interfaces or CAN bus networks requiring stable termination.
• Industrial Controls: PLCs or sensor interfaces where temperature stability is critical.
• Telecom Equipment: High-frequency circuits benefiting from low parasitic effects.
• Power Management: Feedback networks in DC-DC converters.

Conclusion of GS4B034020JCT

The GS4B034020JCT combines high-density integration, robust ceramic construction, and thin-film precision to address demanding circuit design challenges. Its balanced power handling, tight tolerances, and compact SOIC footprint make it a versatile choice for engineers prioritizing reliability in industrial, telecom, and embedded systems. For applications requiring stable performance under thermal stress, this network stands out against generic arrays.