TT Electronics/IRC

GS4B034020JFT

GS4B034020JFT Description

The GS4B034020JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film technology. With a 402Ω resistance per element (±5% tolerance) and a ±25ppm/°C temperature coefficient, it ensures reliable performance across a 70°C to 125°C operating range. The ceramic substrate and gull-wing termination provide robust mechanical and thermal stability, while the 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-density circuits. Packaged in a tube, this non-automotive, non-PPAP compliant component is ideal for industrial and commercial electronics.

GS4B034020JFT Features

• Bussed Network Design: 7 resistors connected in a bus configuration for simplified circuit layout.
• Thin-Film Technology: Delivers high precision (±5% absolute, ±1% ratio tolerance) and low TCR (±25ppm/°C).
• Robust Construction: Ceramic case (SOIC-C series) with gull-wing leads for reliable surface mounting.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H), ±0.1mm tolerances for tight PCB integration.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power handling.
• High Voltage Tolerance: Supports up to 100V, suitable for signal conditioning and divider networks.

GS4B034020JFT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Industrial Controls: Durable resistor networks for PLCs and motor drives.
• Test & Measurement Equipment: Stable reference circuits due to low TCR.
• Consumer Electronics: Space-constrained designs like wearables or IoT devices.
• Power Management: Auxiliary circuits in low-power DC/DC converters.

Conclusion of GS4B034020JFT

The GS4B034020JFT excels in precision, compactness, and thermal stability, making it a superior choice for bussed resistor networks in industrial and commercial applications. Its thin-film ceramic construction and tight tolerances outperform generic thick-film alternatives, particularly in environments requiring long-term reliability. While not suited for automotive use, it is a cost-effective solution for high-density PCBs demanding consistent performance under moderate thermal stress.