TT Electronics/IRC

GS4B034752GGT

GS4B034752GGT Description

The GS4B034752GGT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for surface-mount applications, it features a 47.5KΩ resistance per element with a tight ±2% absolute tolerance and ±2% ratio tolerance, ensuring consistent performance in matched circuits. The thin-film technology delivers a low ±25ppm/°C temperature coefficient, ideal for stable operation across a wide temperature range (70°C to 125°C derated, 125°C max). With a 100V maximum voltage rating and 0.4W total power dissipation, it balances compactness (4.9mm × 5.99mm × 1.45mm) with robustness. The gull-wing termination and 1.27mm pitch facilitate reliable PCB integration.

GS4B034752GGT Features

• Ceramic SOIC-C Case: Enhances thermal stability and durability in harsh environments.
• Bussed Network (7R/8-Pin): Simplifies circuit design for common-bus applications.
• Precision Thin Film: ±25ppm/°C TCR and ±2% tolerance ensure accuracy in signal conditioning.
• High Voltage & Power Handling: 100V rating and 0.05W per resistor (0.4W total) support demanding designs.
• Automation-Friendly: Gull-wing leads and ±0.1mm height tolerance streamline pick-and-place assembly.
• Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and instrumentation use.

GS4B034752GGT Applications

This resistor network excels in:

• Voltage Divider Networks: Precision ratio tolerance (±2%) critical for ADC/DAC reference circuits.
• Signal Conditioning: Stable TCR (±25ppm/°C) minimizes drift in sensor interfaces.
• Industrial Controls: Ceramic package withstands high-temperature environments (e.g., PLCs, power supplies).
• Telecom Hardware: Compact SOIC footprint saves space in RF modules and baseband PCBs.
• Test & Measurement Equipment: Low tolerance and bussed design reduce calibration complexity.

Conclusion of GS4B034752GGT

The GS4B034752GGT combines high precision, thermal resilience, and space efficiency, making it a superior choice for matched-resistor applications where stability and compactness are paramount. Its ceramic construction and thin-film technology outperform polymer-based networks in reliability, while the bussed topology reduces component count. Ideal for industrial, telecom, and precision analog systems, this network delivers consistent performance under stringent operational conditions.