TT Electronics/IRC

GS4B034752JT

GS4B034752JT Description

The GS4B034752JT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Encased in a ceramic SOIC-C series housing, it offers a 47.5KΩ resistance per element with a tight ±5% tolerance and an ultra-low ±25ppm/°C temperature coefficient, ensuring reliability across a wide temperature range (70°C to 125°C). Rated for 100V maximum voltage and 0.4W total power dissipation (0.05W per resistor), this network is ideal for space-constrained PCB designs due to its compact dimensions (4.9mm x 5.99mm x 1.45mm) and gull-wing termination for robust surface mounting.

GS4B034752JT Features

• Advanced Thin-Film Technology: Delivers superior stability and precision compared to thick-film alternatives.
• Ceramic Case (SOIC): Enhances thermal management and mechanical durability in harsh environments.
• Bussed Circuit Design (BUS): Simplifies layout in voltage-divider or pull-up/down applications.
• Low TCR (±25ppm/°C): Minimizes resistance drift under thermal stress, critical for automotive/industrial systems.
• High Power Density: 0.4W total rating in a miniaturized footprint, outperforming similar networks in power handling.
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use where RoHS compliance is not mandated.

GS4B034752JT Applications

• Signal Conditioning: Precision voltage division in sensor interfaces (e.g., strain gauges, RTDs).
• Embedded Systems: Pull-up/down networks for microcontrollers or FPGAs in compact designs.
• Power Management: Current-limiting or bias networks in DC-DC converters.
• Test & Measurement Equipment: Stable reference resistors for calibration circuits.
• Aerospace/Defense: Rugged ceramic construction suits high-vibration environments.

Conclusion of GS4B034752JT

The GS4B034752JT stands out for its ceramic-encapsulated thin-film technology, offering unmatched thermal and electrical stability in a space-saving SOIC package. Its bussed architecture and low TCR make it a top choice for engineers prioritizing precision and reliability in industrial or high-temperature applications. While not RoHS-compliant, its robust performance in non-automotive sectors ensures longevity in demanding circuits.