TT Electronics/IRC

GS4B035111JGT

GS4B035111JGT Description

The GS4B035111JGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed with thin-film technology on a ceramic substrate, it delivers 5.11KΩ resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±2%. The device operates over a wide temperature range of -55°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability in demanding environments. Its ±25ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for precision applications. The SOIC-C series construction provides low thermal EMF and excellent stability, housed in a rectangular, surface-mountable package with gull-wing terminations.

GS4B035111JGT Features

• Bussed Network Design: Simplifies circuit layout with shared common terminals.
• Thin-Film Technology: Ensures low noise, high accuracy, and long-term stability.
• Robust Ceramic Substrate: Enhances thermal performance and mechanical durability.
• Precision Specifications: 5% absolute tolerance, ±2% ratio tolerance, and ±25ppm/°C TCR.
• High Power Handling: 0.05W per resistor (0.4W total) with derating up to 125°C.
• Compact SOIC Package: 4.9mm × 5.99mm footprint and 1.45mm height, ideal for space-constrained designs.
• Surface-Mountable: Gull-wing leads with 1.27mm pitch for automated assembly compatibility.

GS4B035111JGT Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and feedback networks in op-amp circuits.
• Industrial Control Systems: Stable resistance in PLC I/O modules and sensor interfaces.
• Automotive Electronics: Despite not being PPAP/automotive-qualified, it suits non-safety-critical applications like infotainment systems.
• Test & Measurement Equipment: High-accuracy calibration circuits and reference networks.
• Power Management: Load sharing and current sensing in DC-DC converters.

Conclusion of GS4B035111JGT

The GS4B035111JGT combines precision, durability, and compact design, making it ideal for high-reliability electronics. Its ceramic thin-film construction and tight tolerances outperform standard thick-film networks, while the SOIC package ensures compatibility with modern SMT processes. Though not RoHS-compliant, it remains a robust choice for industrial, instrumentation, and telecom applications requiring stable performance across temperature variations.