TT Electronics/IRC

GS4B035112CBT

GS4B035112CBT Description

The GS4B035112CBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Housed in an 8-pin SOIC ceramic package, it offers a 51.1KΩ resistance per resistor with an ultra-tight ±0.25% tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable PCB mounting, while the ceramic case enhances thermal and mechanical durability.

GS4B035112CBT Features

• Precision Performance: Thin film technology delivers ±0.25% tolerance and ±25ppm/°C TCR for critical analog/digital circuits.
• Robust Construction: Ceramic SOIC package ensures high thermal conductivity and resistance to mechanical stress.
• Space-Efficient Design: Compact 4.9mm × 5.99mm × 1.45mm footprint ideal for dense PCB layouts.
• High Reliability: Rated for 125°C maximum operating temperature, suitable for industrial environments.
• Automated Assembly Compatibility: Gull-wing leads and 1.27mm pitch align with SMD manufacturing standards.
• Non-Automotive/Non-PPAP: Optimized for general industrial, telecom, and instrumentation use.

GS4B035112CBT Applications

• Voltage Dividers & Signal Conditioning: Precision networks in data acquisition systems and sensor interfaces.
• Impedance Matching: High-frequency circuits in RF communication modules and test equipment.
• Medical Electronics: Stable performance in patient monitoring devices due to low drift.
• Industrial Control Systems: Durable operation in PLC modules and power management PCBs.
• Aerospace & Defense: Ceramic packaging suits harsh-environment applications with thermal cycling.

Conclusion of GS4B035112CBT

The GS4B035112CBT excels in precision, durability, and miniaturization, making it a top choice for engineers needing stable resistor networks in high-reliability systems. Its ceramic SOIC package, low TCR, and tight tolerance address challenges in signal integrity and thermal management, while the non-automotive designation focuses on industrial and telecom markets. For designs demanding repeatable accuracy and robustness, this network stands out against comparable arrays.