TT Electronics/IRC

GS4B035361DT

GS4B035361DT Description

The GS4B035361DT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. Featuring a 5.36KΩ resistance per element with an ultra-tight ±0.5% tolerance and a low ±25ppm/°C temperature coefficient, this ceramic-based thin-film network ensures stable performance across a wide temperature range (70°C to 125°C). Its SOIC-C series construction offers robust 0.4W total power handling (0.05W per resistor) and a 100V maximum voltage rating, making it suitable for precision analog and digital circuits.

GS4B035361DT Features

• Ceramic Thin Film Technology: Delivers superior stability, low noise, and high reliability in harsh environments.
• Bussed Network (BUS): Simplifies PCB layout by connecting resistors in a common-node configuration.
• Precision Tolerance: ±0.5% absolute tolerance ensures consistent performance in critical applications.
• Wide Operating Range: Derated power up to 125°C, ideal for industrial and automotive-adjacent systems (non-automotive PPAP).
• Compact SOIC Package: 4.9mm × 5.99mm × 1.45mm dimensions with gull-wing leads for easy soldering and inspection.
• Non-RoHS Compliant: Suitable for legacy or exempted applications requiring leaded components.

GS4B035361DT Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision-matched resistors minimize skew in signal conditioning.
• Industrial Control Systems: Stable performance under thermal stress (e.g., PLCs, motor drives).
• Test & Measurement Equipment: Low TCR (±25ppm/°C) ensures accuracy over temperature fluctuations.
• Legacy Electronics Repair: Non-RoHS compliance caters to older designs needing direct replacements.

Conclusion of GS4B035361DT

The GS4B035361DT combines precision, durability, and space efficiency, making it a standout choice for engineers needing reliable bussed networks in compact designs. Its ceramic thin-film construction and tight electrical specs address challenges in analog signal integrity and thermal management, while the SOIC package ensures compatibility with automated assembly. Ideal for industrial, instrumentation, and high-reliability applications where consistency and miniaturization are critical.