TT Electronics/IRC

GS4B035600FT

GS4B035600FT Description

The GS4B035600FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 8-pin narrow SOIC package features 7 bussed resistors with a 560Ω resistance value and a tight ±1% tolerance, ensuring consistent performance in demanding circuits. Built with thin-film technology, it delivers excellent stability with a low ±25ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC-C series construction provides robust thermal and mechanical reliability, with a maximum operating temperature of 125°C and a derated power range of 70°C to 125°C. Its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating suit it for both industrial and commercial applications.

GS4B035600FT Features

• Ceramic substrate for enhanced thermal conductivity and durability.
• Bussed (BUS) circuit design simplifies PCB layout in voltage divider or pull-up/down configurations.
• Gull-wing termination ensures reliable surface-mount (SMD) assembly.
• Precision thin-film resistors with ±1% tolerance and ±25ppm/°C TCR for minimal drift.
• Compact SOIC package (4.9mm × 5.99mm × 1.45mm) with ±0.1mm length/height tolerances for space-constrained designs.
• Non-automotive (PPAP: No) but suitable for industrial controls, test equipment, and communication devices.

GS4B035600FT Applications

This resistor network excels in:

• Signal conditioning circuits requiring stable, matched resistances (e.g., ADC/DAC interfaces).
• Voltage division networks in power management or sensor calibration systems.
• Pull-up/down arrays for digital buses (I2C, SPI) where consistent impedance is critical.
• Industrial automation (PLC modules, motor drives) due to its 125°C operating capability.
• Medical instrumentation where low drift and high reliability are paramount.

Conclusion of GS4B035600FT

The GS4B035600FT stands out for its ceramic-based construction, precision thin-film resistors, and robust SOIC packaging, offering superior thermal performance and long-term stability. While not RoHS-compliant, its bussed design and tight tolerances make it a cost-effective solution for applications demanding high accuracy and repeatability. Engineers will appreciate its balance of compact size, power handling, and temperature resilience, particularly in industrial and measurement systems where component reliability is non-negotiable.