TT Electronics/IRC

GS4B035601CT

GS4B035601CT Description

The GS4B035601CT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for surface-mount applications, it features a ceramic substrate with thin-film technology, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 5.6KΩ resistance per element, it delivers ±0.25% absolute tolerance and an ultra-low ±25ppm/°C temperature coefficient, making it ideal for precision circuits. The SOIC-C series construction provides 0.4W total power dissipation (0.05W per resistor) and supports 100V maximum voltage, meeting demanding industrial requirements.

GS4B035601CT Features

• Bussed Network: 7 resistors connected in a common bus configuration for simplified PCB layout.
• High Precision: ±0.25% tolerance and ±25ppm/°C TCR ensure minimal drift in critical applications.
• Robust Construction: Ceramic case with gull-wing terminations for reliability in harsh environments.
• Compact Footprint: 4.9mm × 5.99mm × 1.45mm (L×D×H) with tight tolerances (±0.1mm height, ±0.2mm depth).
• Wide Operating Range: Rated for 125°C max temperature, derated up to 125°C.
• Non-Automotive: Suitable for industrial, telecom, and instrumentation use (PPAP not required).

GS4B035601CT Applications

• Voltage Division: Precision dividers in ADC/DAC reference circuits.
• Signal Conditioning: Buffering and termination in high-speed data lines.
• Industrial Controls: Stable resistance in PLCs, sensors, and power management.
• Test & Measurement: Calibration equipment requiring low TCR and tight tolerance.
• Telecom Infrastructure: Impedance matching in RF and baseband systems.

Conclusion of GS4B035601CT

The GS4B035601CT excels in precision analog circuits where stability, compactness, and low thermal drift are critical. Its ceramic thin-film design outperforms polymer-based networks in high-temperature environments, while the bussed architecture reduces component count. Though not RoHS-compliant, it remains a top choice for legacy or non-consumer applications demanding rugged performance. Engineers will value its balance of accuracy, power handling, and space efficiency in dense PCB layouts.