TT Electronics/IRC

GS4B035620FBT

GS4B035620FBT Description

The GS4B035620FBT from TT Electronics/IRC is a high-precision 7-resistor thin film network in an 8-pin SOIC package, designed for surface-mount applications. With a 562Ω resistance per element and a tight 1% tolerance, it ensures reliable performance in precision circuits. The network operates over a wide temperature range (-70°C to +125°C) and features a ±25ppm/°C temperature coefficient, making it stable under thermal stress. Its ceramic substrate and gull-wing termination provide robust mechanical and electrical connectivity, while the 0.4W total power rating (0.05W per resistor) suits low-power designs. The 100V maximum voltage rating and non-automotive (PPAP: No) classification make it ideal for industrial and commercial electronics.

GS4B035620FBT Features

• Thin Film Technology: Delivers high accuracy (±1%) and low TCR (±25ppm/°C) for stable performance.
• Ceramic SOIC Package: Enhances thermal management and durability in harsh environments.
• 7-Resistor BUS Configuration: Simplifies PCB layout in multi-channel applications.
• Gull-Wing SMD Termination: Ensures reliable solder joints for automated assembly.
• Wide Operating Range: Functions reliably from -70°C to +125°C, derated at higher temperatures.
• Non-Compliant with EU RoHS: Suitable for legacy or exempted applications.
• Tube Packaging: Protects components during handling and storage.

GS4B035620FBT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor interfaces.
• Industrial Control Systems: Signal conditioning and impedance matching.
• Test & Measurement Equipment: Calibration and reference circuits.
• Communication Devices: Line termination and filtering in RF/mixed-signal PCBs.
• Legacy Electronics: Non-RoHS compliant designs requiring high stability.

Conclusion of GS4B035620FBT

The GS4B035620FBT combines thin film precision, robust packaging, and flexible configuration for demanding electronic systems. Its ceramic construction and wide temperature range make it a reliable choice for industrial and instrumentation applications, while the BUS design reduces component count. Though not automotive-grade, its performance suits high-reliability commercial designs. Engineers will appreciate its balance of accuracy, power handling, and compact form factor in space-constrained PCBs.