TT Electronics/IRC

GS4B035621JBT

GS4B035621JBT Description

The GS4B035621JBT from TT Electronics/IRC is a high-performance 7-resistor thin-film network designed for precision applications. Housed in an 8-pin SOIC ceramic package, it features a 5.62KΩ resistance per resistor with a 5% tolerance and a ±25ppm/°C temperature coefficient, ensuring stable performance across a -70°C to +125°C operating range. With a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this surface-mount (SMD) network is ideal for compact, high-density PCB designs. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable soldering, while the ceramic case enhances thermal stability and durability.

GS4B035621JBT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy (±25ppm/°C) for sensitive circuits.
• Robust Ceramic Package: Ensures mechanical strength and superior heat dissipation.
• Optimized for BUS Applications: The 7-resistor network simplifies circuit design in multiplexed systems.
• Space-Efficient SOIC-8 Form Factor: Compact dimensions (4.9mm × 5.99mm × 1.45mm) suit miniaturized electronics.
• Wide Temperature Range: Operates reliably from -70°C to +125°C, even at derated power.
• Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications.

GS4B035621JBT Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision resistance matching in analog/digital interfaces.
• Signal Conditioning: Stable performance in sensor arrays, ADCs, and DACs.
• Bus Termination Networks: Reduces signal reflection in high-speed data lines (e.g., I²C, SPI).
• Industrial Control Systems: Withstands harsh environments due to ceramic construction.
• Medical & Test Equipment: Low TCR ensures minimal drift in critical measurements.

Conclusion of GS4B035621JBT

The GS4B035621JBT combines thin-film precision, thermal resilience, and compact design, making it a superior choice for engineers prioritizing reliability in tight-layout designs. While non-compliant with EU RoHS, its ceramic SOIC package and wide operational range offer distinct advantages over plastic-encased alternatives. Ideal for industrial, communication, and instrumentation applications demanding stable, matched resistances under thermal stress.